电极电势-pH图在化学镀中的应用

电极电势-pH图在化学镀中的应用 APPLICATION OF THE POTENTIAL-pH DIAGRAM IN THE STUDY OF ELECTROLESS PLATING 费锡明 Fei Ximing 1 first-author 陈永言 Chen Yongyan 1 武汉大学化学系 武汉大学化学系 Chemical Department, Wuhan University Chemical Department, Wuhan University 本文提出用电极电势-pH图分析化学镀反应的电化学机理,解释和说明化学镀工艺中还原剂、络合剂以及pH条件选择。并以化学镀镍为例,绘制了有关的电极电势-pH图,介绍了如何根据电极电势-pH图选择还原剂、络合剂、pH等工艺条件。 In this paper we studied application of the potential—pH diagram in the electroless plating and approched a prediction of themodynamic feasibility of the electroless plating in the both composition and operating conditions for obtaining metal and alloy plating. The reductants and complexing agents available for electroless plating of any given metal can be chose by using the potential—pH diagram. 化学镀 电极电势-pH图 化学镀镍 还原剂 络合剂 electroless plating potential—pH diagram themodynamic feasibility reductant complexing agent 1991-03-01 2021-04-01 3