硅一体化薄膜微电极器件及其应用

硅一体化薄膜微电极器件及其应用 A SILICON INTEGRATED THIN-FILM MICROELECTRODE DEVICE AND ITS APPLICATION 周仲柏 1 2 3 first-author 刘炯权 1 2 3 武汉大学化学系 武汉大学化学系 Department of Chemistry,Wuhan University Department of Chemistry,Wuhan University 美国凯斯西储大学电子设计中心和爱迪生传感器技术中心 美国凯斯西储大学电子设计中心和爱迪生传感器技术中心 武汉大学化学系美国凯斯西储大学电子设计中心和爱迪生传感器技术中心 武汉大学化学系美国凯斯西储大学电子设计中心和爱迪生传感器技术中心 提出用发展中的硅微机械加工技术设计制作硅一体化薄膜微电极器件．这类微电化学器件具有微电极所特有的全部优点，而且由于结构上的一体化，便于器件整体的微型化和集成化．试用薄膜微电极器件电流法常温直接检测ＣＯ２气体，取得了满意的结果。设想通过器件三维构型设计的改进和完善，器件工作的长期稳定性可望进一步提高． A silicon integrated thin-film microelectrode device was developed by using silicon micromachining techniques. This study has shown experimentally that such electrochemical micro-devices exhibited all the advantages which microelectrodes offered in the fieldof electroanalysis,and the CO2 microsensor showed good response characteristics for direct amperometric determination of the CO2 concentration in the gas phase. Furthermore, thinfilm metallization and microlithographic techniques provided the high degree of reproducibility required for the electrode surface of amperometric electrochemical device. These devices were not only excellent in characteristics but also low in cost as a result of batch fabrication, and demonstrated the potential to become miniaturized and multifunctional device.The long-term stability was affected by electrochemical crosstalk between the electrodes under long-term operating conditions. It might be envisaged that several special considerationsare important when designing the device configuration. 微电极 薄膜微电极器件 硅微机械加工技术 microelectrode thin-film microelectrode device silicon micromachining techniques O646 1995-02-01 2021-04-01 2