抗有机杂质镀镍添加剂对镍沉积晶体成核过程的影响

抗有机杂质镀镍添加剂对镍沉积晶体成核过程的影响 EFFECTS OF ANTI ORGANIC IMPURITY ADDITIVE ON ELECTROCRYSTALLIZATION FOR NICKEL PLATING 左正忠 Zuo Zhengzhong 1 first-author 夏绍春 Xia Shaochun 1 武汉大学化学学院 武汉大学化学学院 College of Chemistry, Wuhan University College of Chemistry, Wuhan University 对抗有机杂质镀镍添加剂——“ＷＤＺ－９６１”对镍沉积晶体成核过程的影响进行了研究．结果表明，一方面它对Ｎｉ２＋的电沉积过程中的成核机理没有影响，无论镀液中是否加入该添加剂，电结晶都是连续成核过程；而另一方面，它又可加快电化学成核过程的速度，细化晶粒． Effects of anti organic impurity additive “WDZ 961” on electrocrystallization for nickel platirng were studied. The results show, that on one hand,“WDZ 961” does not change the mechanism of electrochemical nucleation, despite whether the plating solution contains such additive or not, electrocrystallization is always progressive nucleation, on the other hand, it can speed up the process of electrochemical nucleation and fine the nuclei. 镀镍 抗有机杂质添加剂 电化学成核过程 nickel plating anti organic impurity additive procedure of electrochemical nucleation TQ153.12 湖北省自然科学基金(2017CFA007) 1998-02-01 2021-04-01 2